| 摘要 |
<p>A process for manufacturing a semiconductor device comprising the step of mounting a semiconductor component on a printed circuit board, with the electrode of the semiconductor component facing to that of the printed circuit board, the step of testing the function as a semiconductor device with the semiconductor component being mounted on the printed circuit board, the step of joining the electrodes of the printed circuit board and the semiconductor component together to obtain a semiconductor device when the testing result is good, and the step of replacing at least one of the printed circuit board and the semiconductor component with another component of the same type and again testing the function as a semiconductor device when the testing result is not good. By this method, even if the testing result is not good, at least one of the printed circuit board and the semiconductor component can be easily removed and replaced with another one, since the function as a semiconductor device is tested with the semiconductor component being mounted on the printed circuit board, thereby preventing the waste of components and increasing the working efficiency. Furthermore, the semiconductor component has, on one side, an electrode pad to be connected to the electrode of the printed circuit board and also, on the opposite side an electrode pad for testing so that even when the electrode pad formed on one side of the semiconductor component is in contact with the electrode of the printed circuit board and thus hidden, the function test can be conducted easily by using the electrode pad for testing formed on the other side of the semiconductor component.</p> |
