| 摘要 |
<p>The housing has a substrate (3) and an attached rectangular housing frame (1). The substrate acts as the housing base and the housing frame, of a plastics material, is fitted with a flat plastics housing cover. The housing frame has a peripheral bearing surface (12) for the cover with a projecting rim (11) at the same height as the cover. The cover and the rim have cooperating retaining elements (13) for securing the cover to the housing frame. The interior of the protective housing can be filled with a resin mass, enclosing the IC chips (8) mounted on the circuit substrate.</p> |
