| 摘要 |
A lead frame structure and semiconductor package using the same comprise a paddle (21) for mounting a chip, connection leads (23) radiating outwardly away from the paddle, upper and lower dielectric adhesive layers (24, 34) sandwiching the leads (23) therebetween, upper and lower dielectric layers (25, 35) attached on an upper surface of the upper dielectric adhesive layer (24) and a lower surface of the lower dielectric adhesive layer (34), and upper and lower metallic polar plates (26, 36) formed on an upper surface of the upper dielectric layer (25) and a lower surface of the lower dielectric layer (35). The semiconductor package decreases noise such as electromagnetic noise, reflection noise and delta-I noise by providing appropriate characteristic impedances for the leads (23) which act as signal lines and at the same time decreasing the characteristic impedances for the leads (23) which act as power lines or ground lines. The metallic plates are divided into portions (26-1 to 26-4) and (36-1 to 36-4), adjacent portions being mutually insulated but linked by capacitors (27, 37) and connected to the leads (23) acting as power lines and ground lines respectively. The package may be encapsulated. |
