发明名称 PROCESS FOR PREPARING AN INSULATED MULTILAYER STRUCTURE
摘要 A process for preparing an insulated metallized substrate, wherein a specified metallized substrate is heated from ambient temperature to a peak temperature of at least about 800 degrees centigrade while contacting the substrate with an inert atmosphere containing less than 10 parts per million of oxygen, maintained at such peak temperature for a specified period of time while being contacted with said inert gas, and thereafter heated at a peak temperature of at least about 800 degrees centigrade while being contacted with a gas containing at least 100 parts per million of oxygen.
申请公布号 EP0871565(A2) 申请公布日期 1998.10.21
申请号 EP19950944334 申请日期 1995.12.14
申请人 CERAMIC PACKAGING, INC. 发明人 ZSAMBOKY, KALMAN, F.;BALENTS, LEON, M.
分类号 H05K3/46;C04B41/00;C04B41/52;C04B41/80;C04B41/89;C23C8/02;H01F27/28;H01L21/48;H02K3/26;H02N1/00;H05K3/38 主分类号 H05K3/46
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