| 摘要 |
PROBLEM TO BE SOLVED: To polish the whole surface of a wafer by compressing a polishing pad in the adjacent to the end of the wafer by an air pressure in the adjacent to the end of the wafer and matching the height of the polishing pad with a part in contact with the wafer. SOLUTION: A wafer holding tool 5 has such a structure that a rigid body surface 7 superior in its planarity applies a load to the rear face of a wafer 3 across a packing pad 8. A ring air nozzle 9 is positioned in the adjacent to the outside of the wafer 3 and air pressure is applied to the polishing pad 2 by an air jet flow. As a result, the surface 4 of the wafer 3 to be polished is moved by rubbing against the surface of the polishing pad 2 so as to be polished. The polishing pad 2 being in contact with the wafer 3 is compressed by the pressing load, the polishing pad 2 is compressed by the air pressure in the adjacent to the wafer in the outside of the wafer 3, and the surface of the polishing pad 2 is approximately flat so that the whole surface of the wafer 3 can be uniformly polished without any effects of the end of the wafer 3. |
