| 摘要 |
PROBLEM TO BE SOLVED: To improve flatness after polishing by positively retaining a sucked state exerted by the polishing head of a material to be polished in polishing the flat plate-like material to be polished such as a semiconductor wafer. SOLUTION: Polishing cloth is stuck to the upper surface of a turntable 1. Rotary driving is applied to the turntable 1. A polishing head is interposed by facing the turntable 1, and is rotated and driven to suck a material to be polished from its bottom surface. Its top surface is pressed against the polishing cloth. In the polishing cloth 3, upwardly, downwardly penetrated holes 11 are formed in the entire surface of the polishing cloth. Many air-discharging holes 12 are provided in the upper surface of the turntable 1. A cavity part 13 is formed on the top surface of the turntable 1. The discharging holes 12 are penetrated as deep as the cavity part 13. A through hole 14 is formed at the central part of the turntable 1 to supply air to the cavity part 13 from a supply source interposed at the lower part of the turntable 1. |
