发明名称 Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger
摘要 A sealed housing for cooling a plurality of printed circuit cards includes a chassis that supports a plurality of electrical connectors retaining printed circuit cards in mutually adjacent, spatially separated relationship. A first side of a respective printed circuit card is attached to an associated convectively cooled heat exchanger, having a cooling fluid flow chamber containing thermally conductive heat exchange elements through which an internal cooling fluid flows. A sealed, forced cooling fluid recirculation structure is mounted to the chassis and recirculates cooling fluid through heat exchangers of respective printed circuit cards. The sealed, internal cooling fluid recirculation structure contains thermally conductive heat exchangers that are convectively coupled with the internal cooling fluid and are conductively coupled to a distribution of thermally conductive fins on the outside of the chassis.
申请公布号 US5825621(A) 申请公布日期 1998.10.20
申请号 US19970916470 申请日期 1997.08.22
申请人 HARRIS CORPORATION 发明人 GIANNATTO, CARL J.;CORNISH, KEVIN C.
分类号 H05K7/14;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/14
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