| 摘要 |
PROBLEM TO BE SOLVED: To improve a blocking property by forming a pressure sensitive adhesive layer containing silicon high function powder having a specific average grain size, and setting a ratio of thickness between the pressure sensitive adhesive layer and the correction shielding layer in a specific range. SOLUTION: Although any adhesives such as rubber, acrylic resin, colophonium, and silicon can be used for forming a pressure sensitive adhesive layer in application on the base material, acrylic resin adhesive is preferable. Then, silicon high function powder is dispersed in an adhesive with the pressure sensitive adhesive dissolved or dispersed in a solvent. The silicon high function powder can be dispersed irrespective of either an organic solvent or water of these pressure sensitive adhesives. The silicon high function powder dispersed in the adhesive is to be 1-10μm in its average grain size and, most suitably, to be 1-5μm. Also, a ratio of thickness between the pressure sensitive adhesive layer and the correction shielding layer is made 1:1-1:4, thereby obtaining a fine adhesiveness to the adherend during the transferring period, and also improving transferring, shielding, and writing properties.
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