发明名称 Structure for removing a peel-off backing from an adhesive tape
摘要 The invention provides a structure in which an adhesion means that rotates, rocks, or reciprocates is pressed onto at least one side of an adhesive tape. The peel-off backing is subsequently removed from a base material of the adhesive tape by applying force on the adhesion means in the direction that separates the peel-off backing from the base material. The relative magnitudes of adhesive strengths are important, and the use of means such as end adhesion, end creasing, and slight delamination increase the effectiveness of the structure. After delamination, separation hooks separate the elements from the adhesion means.
申请公布号 US5824184(A) 申请公布日期 1998.10.20
申请号 US19950513370 申请日期 1995.08.10
申请人 SEIKO EPSON CORPORATION;KING JIM CO., LTD. 发明人 KAMIJO, NORIYUKI;WATANABE, KENJI;KAMEDA, TAKANOBU;SHIMMURA, TOMOYUKI;AIDA, CHIEKO
分类号 B65H41/00;B29C63/00;B32B43/00;B65C9/00;(IPC1-7):B32B35/00 主分类号 B65H41/00
代理机构 代理人
主权项
地址