发明名称 FILAMENT EMBEDDING METHOD AND FILAMENT EMBEDDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To solve the problem that the place for embedding a filament is limited, and the embedding construction period is elongated so as to heighten the construction cost in embedding a wavy hard synthetic resin pipe used at the time of embedding a filament such as an optical fiber or the like in the ground in a groove bored in the ground to embed the filament. SOLUTION: A pilot pipe 5 where a filament leading-in wire 7 is passed is pushed and buried in the ground 3 between a starting shaft 1 formed on the ground and an arrival shaft 2 by a pipe pushing embed method, a wavy hard synthetic resin pipe 8 for passing a filament is pulled by a wire 7 to be passed through the pilot pipe 5, and only the pilot pipe 5 is pulled out of the ground 3 to embed the resin pipe 8 in the ground 3. A filament 9 previously passed through the synthetic resin pipe 8 is an optical fiber of a guide path wire for the optical fiber to be embedded, and in the case of the guide path wire for the optical fiber, first of all, the guide path wire is passed through the synthetic resin pipe 8 and then the optical fiber is passed through the synthetic resin pipe 8 by the guide path wire.</p>
申请公布号 JPH10280881(A) 申请公布日期 1998.10.20
申请号 JP19970089666 申请日期 1997.04.08
申请人 MORIGUMI:KK 发明人 KAWARA MASAYA
分类号 E21D9/08;F16L1/024;(IPC1-7):E21D9/08 主分类号 E21D9/08
代理机构 代理人
主权项
地址
您可能感兴趣的专利