发明名称 |
Method for forming low contact resistance bonding pad |
摘要 |
The present invention provides a method for forming a bonding pad having a low contact resistance. The method includes steps of: a) forming a bonding pad structure on a substrate having a metal layer by forming a passivation layer over said metal layer and etching the passivation layer with a fluorine-containing gas by which a fluorine-containing layer is formed on a surface of said bonding pad structure; and b) removing the fluorine-containing layer for reducing a contact resistance of said bonding pad structure.
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申请公布号 |
US5824234(A) |
申请公布日期 |
1998.10.20 |
申请号 |
US19960725122 |
申请日期 |
1996.10.02 |
申请人 |
MOSEL VITELIC, INC. |
发明人 |
JOU, CHON-SHIN;WANG, TING-SING;CHEN, CHUN-LIN;TSAI, MING-HUAN;TSAI, MING-RU |
分类号 |
H01L21/311;H01L21/60;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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