发明名称 |
Method for the deposition of diamond film on an electroless-plated nickel layer |
摘要 |
PCT No. PCT/KR94/00115 Sec. 371 Date Feb. 21, 1997 Sec. 102(e) Date Feb. 21, 1997 PCT Filed Aug. 24, 1994 PCT Pub. No. WO96/06206 PCT Pub. Date Feb. 29, 1996A method for the deposition of a diamond film, which includes the steps of immersing metallic or nonmetallic substrate in and electroless nickel plating bath containing a reducing agent to form a nickel layer; and depositing the diamond film on the electroless nickel plated substrate. As a result, employing electroless plating to form an inter layer is improved. In addition, the diamond film can be formed regardless of the type of materials used.
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申请公布号 |
US5824367(A) |
申请公布日期 |
1998.10.20 |
申请号 |
US19970793256 |
申请日期 |
1997.02.21 |
申请人 |
NATIONAL INSTITUTE OF TECHNOLOGY AND QUALITY |
发明人 |
PARK, JUNG-IL;PARK, KWANG-JA |
分类号 |
C30B29/04;B24D3/10;C23C16/26;C23C16/27;C23C16/511;C23C28/00;(IPC1-7):C23C28/00;B05D3/10 |
主分类号 |
C30B29/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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