发明名称 Method for the deposition of diamond film on an electroless-plated nickel layer
摘要 PCT No. PCT/KR94/00115 Sec. 371 Date Feb. 21, 1997 Sec. 102(e) Date Feb. 21, 1997 PCT Filed Aug. 24, 1994 PCT Pub. No. WO96/06206 PCT Pub. Date Feb. 29, 1996A method for the deposition of a diamond film, which includes the steps of immersing metallic or nonmetallic substrate in and electroless nickel plating bath containing a reducing agent to form a nickel layer; and depositing the diamond film on the electroless nickel plated substrate. As a result, employing electroless plating to form an inter layer is improved. In addition, the diamond film can be formed regardless of the type of materials used.
申请公布号 US5824367(A) 申请公布日期 1998.10.20
申请号 US19970793256 申请日期 1997.02.21
申请人 NATIONAL INSTITUTE OF TECHNOLOGY AND QUALITY 发明人 PARK, JUNG-IL;PARK, KWANG-JA
分类号 C30B29/04;B24D3/10;C23C16/26;C23C16/27;C23C16/511;C23C28/00;(IPC1-7):C23C28/00;B05D3/10 主分类号 C30B29/04
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