FILM FOR HOLDING ELECTRONIC PARTS, FILM FOR MOUNTING ELECTRONIC PARTS, ELECTRONIC PARTS MOUNTING METHOD USING THEM, AND MANUFACTURE OF CIRCUIT MODULE

摘要

PROBLEM TO BE SOLVED: To provide a film for keeping electronic parts capable of easily mounting the electronic parts on a substrate. SOLUTION: A film 1 is provided with a plurality of recessed parts 1a-1c capable of inserting and keeping electronic parts Pa-Pc with their connection sides in an exposed condition in the prescribed arrangement. When the electronic parts Pa-Pc are inserted and kept in the recessed parts 1a-1c, a plurality of electronic parts Pa-Pc can be mounted on the substrate in the prescribed arrangement only by releasing the packaging of the electronic parts Pa-Pc by the film 1 in a condition where the connection sides of the electronic parts Pa-Pc packaged by the film 1 are brought into contact with the substrate.