发明名称 Wafer and method of producing same
摘要 No wide bulk diamond wafer exists at present. A wide diamond-coated wafer is proposed instead of the bulk diamond wafer. Diamond is heteroepitaxially deposited on a convex-distorted non-diamond single crystal substrate by a vapor phase deposition method. In an early step, a negative bias is applied to the substrate. In the case of a Si substrate, an intermediate layer of beta -SiC is first deposited on the Si substrate by supplying a low carbon concentration material gas. Then the carbon concentration is raised for making a diamond film. The convex-distorted wafer is stuck to a holder having a shaft which is capable of inclining to the holder. The wafer is pushed to a turn-table of a polishing machine. The convex diamond wafer can fully be polished by inclining the holder to the shaft. A wide distorted mirror wafer of diamond is produced. Fine wire patterns can be made on the diamond mirror wafer by the photolithography. <IMAGE>
申请公布号 EP0689233(A3) 申请公布日期 1998.10.21
申请号 EP19950304282 申请日期 1995.06.20
申请人 SUMITOMO ELECTRIC INDUSTRIES, LIMITED 发明人 TANABE, KEIICHIRO;SEKI, YUICHIRO;IKEGAYA, AKIHIKO;FUJIMORI, NAOJI;TSUNO, TAKASHI
分类号 C30B25/02 主分类号 C30B25/02
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