| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the subject composition adherable at low temperatures in a short time, and effecting high heat-resistance and low hygroscopicity, etc., by compounding an organic solvent-soluble polycarbodiimide resin with an organic solvent-soluble polyimide. SOLUTION: This composition comprises (A) a polycarbodiimide soluble in organic solvents [preferably, a polycarbodiimide of the formula (X is H or F atom; (l) is an integer of 2-400) and (B) a polyimide soluble in organic solvents (preferably, a polyimide containing hexafluoroisopropylidene or isopropylidene structure as well as siloxane structural units). The content of the component B in this composition is preferably 0.1-50 pts.wt. based on the component A, the main component of this composition. Because of its glass transition temperature of <200 deg.C, this composition is excellent in low- temperature processability and adherability to adherends, such as semiconductor elements, and is expected for use as an adhesive for setting treatment of electrical and electronic parts, such as semiconductor chips.</p> |
