发明名称 |
Micromechanical component with a dielectric movable structure, microsystem, and production process |
摘要 |
A micromechanical component includes a fixed micromechanical structure having a pair of capacitor plates being formed of one or more conductive layers, and a movable micromechanical structure being formed of a dielectric layer to be introduced into or removed from an interstice between the plates. A capacitance change is obtained through the resilient or freely movable dielectric, so that the component can be inserted as a proportional or a non-proportional force sensor. A microsystem with an integrated circuit and a micromechanical component with a movable dielectric, as well as a production method for the component and the microsystem, are also provided. |
申请公布号 |
US5824233(A) |
申请公布日期 |
1998.10.20 |
申请号 |
US19960756348 |
申请日期 |
1996.11.26 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
ZETTLER, THOMAS |
分类号 |
G12B1/00;B06B1/06;B81B3/00;B81C1/00;G01L1/14;G01P15/08;G01P15/125;H01L21/306;H01L21/70;H01L21/8234;H01L27/06;H01L29/84;H01L49/00;H02N1/00;(IPC1-7):H01L21/306;H01G7/00 |
主分类号 |
G12B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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