发明名称 |
Semiconductor device having ball-bonded pads |
摘要 |
A method for forming a semiconductor device comprises the steps of providing a semiconductor die having a plurality of pads thereon with at least one bond wire electrically coupled with one of the pads and providing a holder having a cavity therein. The die is placed in the cavity, then a layer of encapsulation is formed within the cavity to cover the die. Subsequently, the encapsulated die is removed from the cavity.
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申请公布号 |
US5824569(A) |
申请公布日期 |
1998.10.20 |
申请号 |
US19960611314 |
申请日期 |
1996.03.05 |
申请人 |
MICRON TECHNOLOGY INC |
发明人 |
BROOKS J MIKE;WOOD ALAN G;DUESMAN KEVIN G |
分类号 |
H01L21/60;H01L23/28;H01L23/31;H01L23/485;H01L29/06;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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