发明名称 Pin usage of a semiconductor package
摘要 <p>Four generally quadrant-like indentations (4a, 4b, 4c, 4d) are formed at the corners of a substrate (2). A conductive member is applied to the inner surfaces of the indentations to form input and output terminals, namely a power voltage terminal (P), a voltage control terminal (VC), a modulation terminal (M), and an output terminal (P). By placing these terminals at the corners of the substrate, sufficient distances are provided between the input terminals and the output terminals so as to prevent interference between these terminals. <IMAGE></p>
申请公布号 EP0871220(A2) 申请公布日期 1998.10.14
申请号 EP19980302724 申请日期 1998.04.07
申请人 MURATA MANUFACTURING CO., LTD. 发明人 SAKAI, KEN
分类号 H05K9/00;H01L23/12;H01L23/498;H01L23/50;H03B1/00;H03B5/02;H05K1/02;H05K3/40;(IPC1-7):H01L23/498 主分类号 H05K9/00
代理机构 代理人
主权项
地址