MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To make clear an accessory printing and at the same time prevent a semiconductor element from being cracked, by joining a number of semiconductor elements and a semiconductor device wafer body onto a UV sheet where a gel-shaped, thermosetting, and colored epoxy resin layer is provided, cutting it, and separating it individually while leaving the UV sheet. SOLUTION: A gel-shaped, thermosetting, and colored epoxy resin layer 14 is applied to one surface of a UV sheet 22. A semiconductor device wafer that is connected to a plurality of semiconductor element 11 are prepared. A semiconductor device wafer is subjected to dicing by a dicing line 28 for separating for each semiconductor device. The dicing is made so that all or one portion of the UV sheet 22 at the surface side of the semiconductor element 11 can remain. Ultraviolet rays are applied to the UV sheet 22 for softening, and a specific semiconductor device is separated from the sheet 22. An accessory 21 is printed to the surface side of the individual semiconductor device being taken out with an ink having a different color, thus clearing recognizing the printing and further protecting the semiconductor element 11.