PRINTED-WIRING BOARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-wiring board which can lower the resistance of an interstitial via hole(IHV) manufactured by filling a metal paste. SOLUTION: A conductor 4 which contains a metal powder is filled into a via hole 3 which is formed in an insulating board 1 containing at least an organic resin such that its end part protrudes from at least one surface of the insulating board 1. After that, a wiring layer 7 which is composed of a metal foil is laminated on the protrusion 6 of the conductor 4. A pressure is applied via the wiring layer 7. The protrusion 6 is compressed and filled into the via hole 3. The wiring layer 7 is buried into the surface of the insulating board 1 such that there is substantially no difference in level from the surface of the insulating board 1. A via-hole conductor in which the filling rate of the metal conductor is 75% or higher and whose volume resistivity is 9.5×10<-6>Ω-cm or lower is formed.