| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal plate base used for a printed-wiring board formed of a resin insulated layer and a conductive metal foil laminated successively on one face of the base, and provided with a resin layer formed on an opposite face and provided with heat-resistant blocking properties, etching solution resistance, organic solvent cleaning resistance and processability. SOLUTION: A polyester resin layer composed of polyester resin of number- average molecular weight of 6000 or less into which flexible component type epoxy resin of number-average molecular weight of 350-850 of 6-25 wt.%. and a curing agent of 10-20 wt.% composed of butylated melamine resin and methylated melamine resin at the ratio of 95/5-70/30 are added is formed into the thickness of 5-30μm by baking and curing. |
