发明名称 |
Electronic circuit device |
摘要 |
An electronic circuit device includes a substrate, a wiring layer formed on the surface of the substrate and essentially consisting of at least one metal selected from the group consisting of gold, copper, tin, and aluminum, a bump formed on the wiring layer and essentially consisting of at least one metal selected from the group consisting of gold, copper, and aluminum, and a micro electronic element formed on the bump, wherein solid-phase diffusion bonding is performed at least either between the wiring layer and the bump or between the bump and an electrode of the micro electronic element.
|
申请公布号 |
US5821627(A) |
申请公布日期 |
1998.10.13 |
申请号 |
US19970962882 |
申请日期 |
1997.11.05 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MORI, MIKI;KIZAKI, YUKIO;YASUMOTO, TAKAAKI;YAMAKAWA, KOJI;SAITO, MASAYUKI;UCHIDA, TATSURO;TOGASAKI, TAKASI;YEBISUYA, TAKASHI;MURAKAMI, TAIJUN |
分类号 |
H05K3/32;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H05K3/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|