| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent strains induced in a solder bump from being concentrated, so that a solder bump joint is improved in reliability by a method, wherein the bumps are provided, and only fine voids of nearly uniform size are present at an interface between all the bumps nearest the outer edge of a semiconductor device and the semiconductor device. SOLUTION: A semiconductor element 4 is bonded to a ball-grid array board 2, and the ball-grid array board 2 is electrically connected to the semiconductor element 4 with a wire 5, which are sealed up with sealing resin 6. On the other hand, solder bumps 1 are bonded as an outer terminal to the rear of a ball-grid array semiconductor device, and the ball-grid array semiconductor device is mounted on a mounting board 3. Only uniform and fine voids are present at a joint interface 7 of the solder bumps 1. By this setup, strains induced in the solder bumps 1 at a thermal transformation time is restrained from concentrating on a part of the bump 1, so that a solder bump joint can be surely improved in connection reliability.</p> |
