| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance a semiconductor package in productivity by a method, wherein the inner ends of the column leads of a first semiconductor package board are located inside the board more inward than the inner ends of the column leads of a second semiconductor package board. SOLUTION: An outer molded frame 11, an inner molded frame 7, and a column lead support pad 9 are dismounted, and a unit frame column frame 12 is formed. Then, the unit frame column frame 12 is cut off in a direction of B-B of the formation of a second semiconductor package board 1' (second board). On the other hand, a first board 1 has been previously manufactured, and the second board 1' is bonded to the upside of the first board 1 overlapping with each other. The inner edges of the column leads of the first board 1 are located inside the board 1' more inward than those of the column leads of the second board 1'. Then, a semiconductor chip 3 is housed in a through-hole 8 provided in the second board 1' and a center stepped part provided from above the first board 1 where the second board 1' is laminated, and a necessary space is sealed up, whereby a semiconductor package is manufactured.</p> |
