发明名称 ELECTRONIC-COMPONENT ASSEMBLY AND ITS MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To obtain an electronic-component assembly by which the distance between a board and a flexible board mounted on the board can be made uniform. SOLUTION: This assembly comprises a mounting board 1, an organic film 2 which is mounted on the mounting board 1, support members 4 which connect the surface of the mounting board to the organic film 2 and a resin 6 which is filled between the mounting board 1 and the organic film 2. Through holes 231 are formed in the organic films 2, mounting electrodes 1 are formed on the mounting board 1, and the through holes 231 and the mounting electrodes 11 are connected by the support members 4.</p>
申请公布号 JPH10275965(A) 申请公布日期 1998.10.13
申请号 JP19970078174 申请日期 1997.03.28
申请人 NEC CORP 发明人 TAMURA HIROYOSHI
分类号 H05K1/11;H05K1/14;H05K1/18;H05K3/36;H05K3/46;(IPC1-7):H05K1/14 主分类号 H05K1/11
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