摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an electronic-component assembly by which the distance between a board and a flexible board mounted on the board can be made uniform. SOLUTION: This assembly comprises a mounting board 1, an organic film 2 which is mounted on the mounting board 1, support members 4 which connect the surface of the mounting board to the organic film 2 and a resin 6 which is filled between the mounting board 1 and the organic film 2. Through holes 231 are formed in the organic films 2, mounting electrodes 1 are formed on the mounting board 1, and the through holes 231 and the mounting electrodes 11 are connected by the support members 4.</p> |