| 摘要 |
PROBLEM TO BE SOLVED: To provide an LSI package, so as to effectively suppress the generation of noise and reduce mounting area for LSI. SOLUTION: In an LSI package, including an IC chip portion 1, a plurality of lead wires 3 and a cover portion 5 of structure covering all of one end of each lead wire 3, the IC chip portion 1 and a plurality of bonding wires 4, wiring pads 11 connected respectively to a power terminal portion 1a and a ground terminal portion 1a of the IC chip portion 1 via respective wiring member 13 are provided on the cover portion 5 of the IC chip portion 1, and each wiring member 11 is provided through the cover portion 5 to mount a bypass capacitor 12 on the cover portion 5. |
