| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for a semiconductor device, which can prevent the leakage of sealing resin at a package corner part, and can improve the yield of the assembly of a mold package, by preventing the peeling or chipping at the end of a resin dam bar. SOLUTION: A slit 7 is provided, so that its one part may lie upon the section to contact with a resin dam bar 8 besides being at the handing lead retainer 4 of a lead frame 1 for a semiconductor device. Hereby, the adhesion between the resin dam bar 8 and the lead frame 1 can be improved, so that the peeling or chipping at one end of the resin dam bar can be prevented. What is more, since the slit 7 is in such a form that it is closed in the inner direction of the package, it does not incur troubles such as sealing resin flowing into the slit, its falling in a finishing process, and breaking a mold. |
