发明名称 MOLD CLAMPING MECHANISM FOR THEIEOPLASTIC RESIN INJECTION COMPRESSION MOLDING MACHINE AND THERMOPLASTIC RESIN INJECTION COMPRESSION MOLDING MACHINE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping mechanism, which can be applied to a molded item which cannot be molded by an injection compression molding method. SOLUTION: A sprue bush 7 is fixed to a fixing side die mount plate 6 and the forward end of the bush 7 is inserted into a fixing plate 8 to make slidable the plate 8, as a fixing side die movable plate, with respect to the plate 6. A movable side die 9, comprising a female side cavity plate 91 and a male side cavity plate 92, is made slidable with respect to the plate 8, and the plate 6, plate 8, and die 9 are put into a mold clamping mechanism after the completion of clamping of the die, where there is no mold clamping force or a little mold clamping force. And an open/closure valve 5 is opened to feed molten resin into s sprue 72 from a nozzle 41, thereby storing the resin in the forward end of the bush 7, and simultaneous with the completion of feed of the resin, the valve 5 is closed to generate a high injection pressure in the mechanism, whereby the resin stored in the end of the bush 7 is filled into a molded item cavity 13.
申请公布号 JPH10272660(A) 申请公布日期 1998.10.13
申请号 JP19970078278 申请日期 1997.03.28
申请人 TOKAI JIYUKEN KOGYO KK 发明人 SEKIDO NORITSUGU
分类号 B29C45/67;B29C45/46;B29C45/56;B29C45/70;B29K101/12;(IPC1-7):B29C45/70 主分类号 B29C45/67
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