| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion of an unexposed part to a substrate without considerably deteriorating dry etching resistance by incorporating a compd. generating an acid when degraded and a specified resin. SOLUTION: This photoresist compsn. contains a compd. generating an acid when degraded by irradiation with active light or radiation and a resin having repeating structural units represented by formula I and having groups which are decomposed by the action of the acid and increase solubility in an alkali developer. In the formula I, R1 is H or alkyl, preferably methyl or ethyl, especially preferably methyl and A is alkylene, substd. alkylene such as a group represented by formula II, ether, etc., or a group obtd. by combining two or more such groups. In the formula II, each of R5 and R6 is H, alkyl, etc. |
