WIRE SAW AND METHOD FOR CUTTING INGOT

摘要

PROBLEM TO BE SOLVED: To provide a wire saw by which irregularities in the inner face thickness of a cut wafer can be reduced and a method for cutting an ingot for the wafer. SOLUTION: An ingot 29 is cut by moving back and forth and also fluctuating a wire line 11 with the help of a shuttle motion means 13 and a fluctuating means 14, while supplying a whetting liquid (a) to an area near the cut part of an ingot 29 by a whetting liquid supply means 12. At the time of cutting, the fluctuation angle (α) of the wire line 11 proportional to the contact length between the wire line 11 and the ingot 29 is controlled by the fluctuation angle control means 15a of a control part 15. Therefore, it is possible to stably cut even the cut starting part or the cut ending part of the ingot 29. Consequently, irregularities in the inner face thickness of a wafer can be reduced and the high-quality wafer can be obtained.