发明名称 |
Semiconductor component with insulating housing |
摘要 |
A semiconductor component includes an insulating housing. A plurality of sheet-metal mounting plates are disposed in one and the same plane and are electrically separated from one another in the housing. Semiconductor switches of a rectifier bridge are electrically conductively secured to the mounting plates. Sheet-metal connection leads are electrically connected to the semiconductor switches. At least one sheet-metal connection lead is electrically connected to the mounting plates.
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申请公布号 |
US5821618(A) |
申请公布日期 |
1998.10.13 |
申请号 |
US19950514771 |
申请日期 |
1995.08.14 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
GRAF, ALFONS;HUBER, PETER;SCHLOEGEL, XAVER;SOMMER, PETER |
分类号 |
H01L23/12;H01L23/495;H01L25/00;(IPC1-7):H01L23/34;H01L29/74;H01L31/111;H01L29/861 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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