发明名称 Semiconductor component with insulating housing
摘要 A semiconductor component includes an insulating housing. A plurality of sheet-metal mounting plates are disposed in one and the same plane and are electrically separated from one another in the housing. Semiconductor switches of a rectifier bridge are electrically conductively secured to the mounting plates. Sheet-metal connection leads are electrically connected to the semiconductor switches. At least one sheet-metal connection lead is electrically connected to the mounting plates.
申请公布号 US5821618(A) 申请公布日期 1998.10.13
申请号 US19950514771 申请日期 1995.08.14
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 GRAF, ALFONS;HUBER, PETER;SCHLOEGEL, XAVER;SOMMER, PETER
分类号 H01L23/12;H01L23/495;H01L25/00;(IPC1-7):H01L23/34;H01L29/74;H01L31/111;H01L29/861 主分类号 H01L23/12
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