| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bonding tool and a bonding device which can improve productivity, while taking an advantage of superior general versatility and stability of junction of a single-point bonding method. SOLUTION: In order to bond inner leads 102A of film carrier tape to bumps 105 of a semiconductor chip with a single-point method, the tip of a bonding tool 100 is provided with multiple spherical protrusions of the same height with spaces identical to those of the inner leads 102A. This enables multiple points of ILB(inner lead bonding) at one time. In this way, a bonding device with single-point method is provided with general versatility and productivity of a multipoint bonding method, while maintaining stability of junction in the single-point bonding method. |
