| 摘要 |
PROBLEM TO BE SOLVED: To prevent the corrosion of an aluminum thin film in the cleaning process of a substrate after a resist stripping process by using the pure water of weak acid for not causing metal corrosion as cleaning liquid in the cleaning process of the substrate after the resist stripping process. SOLUTION: An Al-Cu film 2 is formed on a crystal substrate 1 in the film thickness of 300 nm, positive type photoresist 3 containing novolak resin is applied on the Al-Cu film 2, then a resist pattern 30 is formed, etching is performed by mixed acid whose main component is phosphoric acid and thus. a desired electrode pattern 20 is formed. Then, the resist pattern 30 is stripped off by using neutral stripping liquid and cleaning is performed with the pure water finally. In the cleaning process, by using the pure water of the weak acid as the cleaning liquid, the generation of the metal corrosion is prevented, the degradation of device characteristics by the corrosion does not occur and the yield of production is improved. |
