| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance sealing resin adhesion to a lead frame by a method, wherein an Au thin film is provided to a palladium metal film on the surface of the outer lead of the lead frame outside a region which comes into contact with a resin that seals up a semiconductor chip. SOLUTION: A die pad 2, a lead 3 and the like are formed inside a main material 11. Thereafter, a plating base layer 12 is formed on the surface of the main material 11. Then, the plating base layer 12 of the main material 11 is plated with a Pd layer 13 which is good in solderability on an outer lead 3b of the lead 3 and wire-bonding properties on the inner lead 3a of the lead 3. Then, a first resist pattern 31 and a second pattern 32 are formed on the surface of the lead frame opposite to its other surface mounted with a semiconductor chip. Then, the Pd layer 13 on the lead frame 1, where the first and second pattern, 31 and 32, are not formed, is plated with an Au thin film 14.</p> |
