| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to mount any forms of FPC boards on a transfer carrier, by a method wherein, when the flexible printed boards mounted with surface mounting components on the surfaces of one side of the surfaces thereof are supported by the carrier facing upward the other surfaces of the boards, opening parts for accepting the surface mounting components mounted on the surfaces on one side are provided in the carrier. SOLUTION: Surface mounting components are respectively mounted on the surface on one side of the surfaces of flexible printed boards FPC 5 and thereafter, the FPC boards 5 are inverted and are placed on a transfer carrier 1 for mounting surface mounting components on the other surfaces of the FPC boards 5. At this time, the mounting components mounted on the substrate intrude into open parts 4 provided in the carrier 1. Therefore, the surfaces on one side of the surfaces of the FPC boards 5 are closely adhered to the surface of the carrier 1 and are supported by the carrier. Accordingly, the state of the planes of the FPC boards 5 is held and a solder printing can be made on the surfaces of the boards 5. Moreover, if a plurality of the opening parts 4 are provided in the carrier 1 and the mounting positions of the surface mounting components are taken into consideration in advance, any forms of the FPC boards can be placed on the carrier 1. |
