ULTRAHIGH FREQUENCY BAND RADIO COMMUNICATION EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To miniaturize an equipment while the characteristics of antennas are secured by providing the reception antenna and the transmission antenna on the surface of a package through the use of the package having an electrically constricted part forming a high space whose cutoff frequency is higher than the carrier frequency of radio communication at the periphery of a semiconductor chip. SOLUTION: Feeding lines 9 for the antennas 1 and 3 and slots 10 are provided on a high frequency circuit board 2. They are loaded on a module casing 6 constituted of a conductive material so that the circuit board 2 becomes a cover. The areas of the module casing 6 and the circuit board 2 are covered by the solid pattern of ground at a part except for wiring. The semiconductor chip 5 is mounted so that it is positioned in the constricted part 8. The area of the high frequency circuit board 2 in the constricted part 8 is covered by the solid pattern of ground. Since the antenna elements 1 and 3 are positioned on the surface (back of high frequency circuit board 2), they are not affected by the wall face of the casing 6.