| 摘要 |
The invention relates to a method for encapsulating electronic components mounted on a carrier, such as for instance a lead frame, printed circuit board, substrate, or film, comprising the successive steps of: a) fixing on a carrier a covering element provided with a recess such that the recess receives at least one electronic component, b) injecting a curing moulding material into the recess wherein at least a part of the gases situated in the recess leaves the recess through at least one venting aperture arranged for that purpose in the covering element, and c) curing the moulding material in the recess. The invention also relates to a covering element for performing this method. |
