发明名称 METHOD AND DEVICE FOR REPAIRING CONDUCTIVE PATTERN
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and device for repairing conductive pattern by which the disconnection and breakage of a conductive pattern can be repaired mechanically with high efficiency and which are particularly suitable for the repair of such a conductive pattern that is composed of extremely narrow thin lines. SOLUTION: The disconnected or broken part of a conductive pattern of electrodes, etc., formed on a substrate 2 is repaired by supplying conductive paste prepared by dispersing very fine particles of a conductive material in a dispersion medium in a drop-like or linear state through a repair pen 8 which is freely moved on the surface of the substrate 2 and forming a conductive film by locally heating the supplied paste. A camera 13 for detection detects a spot to be repaired and the pen 8 is positioned to the spot to be repaired. Then the conductive paste is supplied to the spot while a camera 14 for monitor monitors the supplying state of the paste and a heating means which moves together with the pen 8 forms a conductive film by locally heating the supplied paste.</p>
申请公布号 JPH10270843(A) 申请公布日期 1998.10.09
申请号 JP19970077335 申请日期 1997.03.28
申请人 VACUUM METALLURGICAL CO LTD;GRAPHTEC CORP;S C I:KK 发明人 SUZUKI TOSHIHIRO;ODA MASAAKI;NOGUCHI MASATOSHI;SAKAMOTO TAKAHITO
分类号 B23K26/00;G09F9/00;H01J9/50;H05K3/22;H05K3/40;(IPC1-7):H05K3/40 主分类号 B23K26/00
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