SEMICONDUCTOR WAFER POLISHING DEVICE WITH SOFT CARRIER PLATE

摘要

PROBLEM TO BE SOLVED: To apply an uniform pressure all over a semiconductor wafer by connecting a wafer carrier film to a rigid plate, fixing a holding ring to the plate around a wafer contact section and connecting a vacuum source and a pressurized fluid source to a cavity of a carrier head alternately. SOLUTION: An end of a spindle shaft 12 of a carrier head 10 is attached to a rigid carrier plate 14 and a holding ring 40 is attached to a lower surface 20 of the carrier plate 14 by a recess 26 in a circumference. A circular wafer carrier film 46 is held between the holding ring 40 and the carrier plate 14 and a cavity 58 is provided between the wafer carrier film 46 and the carrier plate 14, a valve of a vacuum source is closed and the cavity 58 is charged with pressurized fluid from a pressurized fluid source through a bore 39 of the spindle shaft 12. Thereby, a uniform pressure can be applied all over the semiconductor wafer 60.