HEAT TREATMENT FURNACE FOR SEMICONDUCTOR MANUFACTURING DEVICE,申请号JP19970087370-传众专利搜索

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发明名称	HEAT TREATMENT FURNACE FOR SEMICONDUCTOR MANUFACTURING DEVICE
摘要
申请公布号	JPH10270372(A)	申请公布日期	1998.10.09
申请号	JP19970087370	申请日期	1997.03.21
申请人	KOKUSAI ELECTRIC CO LTD	发明人	ISHIHARA SHOJI
分类号	H01L21/302;H01L21/205;H01L21/26;H01L21/3065;H01L21/324;(IPC1-7):H01L21/26;H01L21/306	主分类号	H01L21/302
代理机构		代理人
主权项
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