| 摘要 |
PROBLEM TO BE SOLVED: To easily and inexpensively generate IC having high shielding effect through the use of existed equipment, by covering the upper face of an IC chip with a metal plate connected to GND potential. SOLUTION: A metal plate 14 which does not cover bonding pads 16 of an IC chip 17 is adhered to the upper face of the IC chip 17. The metal plate 14 has projection parts 14' on both upper/lower side parts. The projection parts 14' are electrically connected with specified GND pads 20 on the IC chip 17 by conductive adhesive 18. The specified GND pads 20 are connected to GND potential in IC and the metal plate 14 is also connected to GND potential. Since the upper face of the IC chip 17 is shielded by the metal plate 14 connected to GND, high shielding effect can be obtained without changing the size and the quality of a package. |
