发明名称 WAFER PROBE TEST METHOD AND WAFER PROBER
摘要 <p>PROBLEM TO BE SOLVED: To eliminate wrong operativity due to densely arranged probes and inkers by spacing a plurality of prober heads apart by one die or a plurality of dice mutually and measuring each die corresponding to a prober head simultaneously. SOLUTION: At first, dice D1, D4 spaced by two dice apart mutually are measured simultaneously. After the measurement, each die is moved by one die and dice D2, D5 are measured simultaneously. After measurement is finished, each die is moved by one die similarly, and dice D3, D6 are measured simultaneously. By this process, dice D1 to D6 are measured. Then, each die is moved by four dice, and dice D7, D10 are measured simultaneously. Operation is proceeded making the above procedures one cycle and thereby a wafer test when measurement positions are spaced by two dice apart becomes possible. It is possible to eliminate wrong operativity due to densely arranged probes and inkers in this way.</p>
申请公布号 JPH10270510(A) 申请公布日期 1998.10.09
申请号 JP19970094763 申请日期 1997.03.27
申请人 NEW JAPAN RADIO CO LTD 发明人 HOSAKA FUJIO
分类号 G01R1/073;G01R31/28;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R1/073
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