| 摘要 |
PROBLEM TO BE SOLVED: To make the surface of insulating resin non-adhesive by using photoresist resin, which includes comb-shaped graft polymer copolymerizing silicone monomer and acrylic monomer, or a resin having both photosensitive and thermosetting characteristics, for an insulating layer. SOLUTION: An insulating layer 3 is formed on a circuit surface whereupon a first circuit 2 is formed. Then, on the insulating layer 3, a via hole 6 which connects with the first circuit 2 is formed by exposure through a photomask 4 provided for forming the via hole 6 and by etching the unexposed area with developer. Then, the insulating layer 3 is treated with oxidizing roughening solution, copper is plated on the insulating layer 3 and formation of a second circuit 8 and interlayer connection for the via hole 6 are performed. Such procedures are repeated to form a multilayered structure. In this case, a resin insulating layer, which is formed of photoresist resin that includes comb-shaped graft polymer copolymerizing silicone monomer and acrylic monomer or a resin having both photosentive and thermosetting characteristics, is used as an interlayer insulating layer. |
