| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging structure which enables electrical connection between external leads and pads of a semiconductor chip by direct attachment without using adhesive, and which dispenses with resin sealing. SOLUTION: Leads 20 respectively have an engaging member having a C- shaped cross-sectional shape which allows engagement between the leads 20 and the ends of the chip. The engaging members hold the semiconductor chip 10 by their elasticity or plastic deformation to bring the contact at one end of each lead 20 into direct contact with each pad 11 of the semiconductor chip. Further, the engaging members respectively include an insulating layer 30 for isolation except the contacts between the leads 20 and the semiconductor chip 10. The plurality of leads 20 are arrayed in parallel at predetermined intervals and integrated via the insulating layers 30. The leads 20 engage with the semiconductor chip 10 from the peripheral end portions. These members construct an integration member 100. |
