NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND PASTE PATTERN FORMING METHOD BY USING SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of being easily stripped off in an aqueous solution and forming an overhung resist pattern and the paste pattern forming method by using this composition superior in reproduction performance and strippability by incorporating a water-soluble polymer and a diazo compound and a polymer emulsion. SOLUTION: The paste pattern is formed by forming on the substrate the negative photosensitive resin composition layer for a liftoff system, comprising the water-soluble polymer and the diazo compound and the polymer emulsion and selectively removing imagewise exposed parts from the resin composition layer by the lithographic method, and filling the removed parts with a paste composition, and removing the remaining photosensitive resin layer.