| 摘要 |
PROBLEM TO BE SOLVED: To thin down a package by lowering the heigh of a bonding loop wire. SOLUTION: The semiconductor device includes a plurality of electrode pads provided on a semiconductor element 1, leads L connected to the electrode pads through bonding wires W, and common lines 2a and 2b provided on the semiconductor element 1 for bringing ones of the plurality of electrode pads which handle common signals in a continuity. The common lines 2a and 2b are coated at least on its surface with a second insulating adhesive tape as an insulating member. |
