MOUNTING STRUCTURE OF POWER TRANSISTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a superior assembling characteristic as well as superior maintenance and repairing service without requiring any exclusive component parts for use in fixing a power transistor module or a thermal radiating heat sink and without increasing a soldering step, perform a connecting state between the thermal radiating heat sink and the power transistor module in an appropriate thermal conductive relation without fail so as to improve reliability in operation. SOLUTION: A power transistor module 5 has two rows of lead pins 12 extending at a side opposite to a thermal radiating base plate 11 arranged at its one surface (for example, a DIP type). The power transistor module 5 is fixed by the two rows of lead pins 12 on a printed circuit board by a leadthrough loading method at the same plane as a lead-through loading surface (a surface A) of the printed circuit board 1 for electrical parts 2 to 4, and a thermal radiating heat sink 6 is fixed by bolts 13 to the thermal radiating base plate 11 of this power transistor module 5.