发明名称 MATERIAL FOR FORMING MULTILAYERED WIRING AND CONNECTOR WITH MULTILAYERED WIRING
摘要 PROBLEM TO BE SOLVED: To provide a material for forming multilayered internal-layer wiring from which a connector having individual multilayered internal wiring structures can be manufactured extremely easily and a method for manufacturing the material. SOLUTION: A connector is provided with a laminated insulating layer body 12 composed at least of three insulating layers and first and second wiring layers D1 and D2 respectively provided on the first and second interfaces F1 and F2 between two adjacent insulating layers of the laminated body 12. Each of the first and second wiring layers D1 and D2 is constituted by regularly arranging a plurality of independent linear conductive lines LA and LB in such a state that the conductive lines on the first wiring layer D1 and those of the second wiring layer D2 intersect each other and the intersections of the conductive lines are arranged regularly when the laminated body 12 is seen through in the laminating direction.
申请公布号 JPH10270849(A) 申请公布日期 1998.10.09
申请号 JP19970071229 申请日期 1997.03.25
申请人 JSR CORP 发明人 HANAWA KAZUMI;KOYAMA KENICHI
分类号 H01R11/01;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01R11/01
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