| 摘要 |
PROBLEM TO BE SOLVED: To keep the bending deformation to a small value or zero by providing at least a dummy bump at a central part inside each of regular bumps on either face or both faces of two IC chips. SOLUTION: Each of connecting electrode pads 4a has a bump 4b protruding to one IC chip 2. At least a dummy bump 3 at a central part inside connecting electrode pads 4a on the bottom face of another IC chip 4 protrudes to the chip 2. If an external force is exerted on the central parts of both chips 2, 4 inside the bumps 4b in their peripheries enough to bend the central parts of the chips so as to mutually approach, a soft film 3 adhered to the central part keeps this bending deformation to a small value or zero. |
