| 摘要 |
PROBLEM TO BE SOLVED: To improve throughout by forming the compact configuration for an entire device and the yield of product at the same time. SOLUTION: The main part of this device is constituted of the inserting part of a carrier 1, which contains a wafer W to be processed in the horizontal state, the carrying-out unit of the carrier 1, a wafer taking-out arm 14 which takes out the wafer W in the carrier 1, a wafer containing arm 16 which contains the wafer W into the carrier 1, a position changer 40 which changes the wafer W into the horizontal state and the vertical state, a processing unit 3 for adequately processing the wafer W, and a wafer carrying arm 56 which receives and delivers the wafer W between the position changer 40 and the processing unit 3 and feeds or accepts the wafer W into or out of the processing unit 3. Thus, the processing is performed adequately after the wafer W housed in the carrier 1 under the horizontal state is taken out and the position is changed to the vertical state. After the processing, the position is converted into the horizontal state, and the wafer can be contained in the carrier 1. |
